This equipment is made of imported platform, with independent intellectual property rights, specialized for semiconductor power devices, IGBT and other high-power modules, products that require high-temperature soldering.

This equipment adopts embedded control system, dual CPU computing, can run independently from the computer (computer crash), not only stable & reliable, but also more accurate in temperature control.

This equipment adopts ultra-high temperature design, which can meet the soldering needs of ultra-high temperature products. The machine supports recipe functions for critical parameters. MES remote data reading.

Step-by-step vacuum design with up to 5 steps vacuuming.

The patented water-cooled structure of the sealing ring, not only durable and lower cost of use, but also reduces costly product damage caused by poor sealing.

Vacuum level can reach 0.1KPa, single void rate ＜1%, total rate ＜2%.

The fastest cycle time:30s / cycle, warmup time is 30min.

The machine adopts microcirculation air transportation, and the temperature difference inside the temperature zone is smaller.