⦁ This equipment uses the imported platform, dedicatedly built, with independent intellectual property rights, breaking the international blockade and monopoly of semiconductor vacuum soldering equipment, specialized for SOP, SOT, DIP, QFN, QFP, BGA, IGBT, TO, MINI LED and other vacuum chip package soldering;

⦁ This equipment adopts industrial embedded control system, with dual CPU calculation, can run independently from the computer (computer crash), not only stable and reliable but also more accurate in temperature control, provide replaceable heating modules, to effectively solve the phenomenon of tin frying caused by temperature difference;

⦁ Exclusive patented flux & paste collection system reduces equipment maintenance and cleaning.

⦁ The machine supports recipe functions for key soldering parameters and MES remote data reading.

⦁ Intelligent nitrogen monitoring and control system, not only saves gas, but also has a lower oxygen content.

⦁ Step-by-step vacuum design, up to 5 steps of vacuuming process.

⦁ The patented water-cooled structure of the sealing ring, not only has a longer life and lower cost of use, but also reduces product damage caused by poor sealing.

⦁ The maximum vacuum can reach 0.1KPa, void rate: single void rate ＜0.5%, total rate ＜1%.

⦁ The fastest cycle time is 25s, the highest efficiency and the heating time is about 30min.

⦁ Perfect match for ASM and domestic DB equipment.