August 19, 2025 — As global competition in the semiconductor industry intensifies, vacuum reflow soldering, a core chip-packaging process, has recently achieved significant breakthroughs in technology innovation and domestic substitution, pushing China’s semiconductor equipment industry toward high-quality development.

Technology breakthroughs: domestic equipment now rivals international performance
Huaxin, together with university research teams, has developed a new generation of vacuum reflow equipment with multiple breakthroughs:
1. Ultra-low vacuum control: vacuum down to the 10^-3 Pa class effectively suppresses oxidation, reducing the joint void rate below 0.5% — an internationally leading level;
2. Intelligent temperature control: AI algorithms precisely regulate the temperature profile with ±1.0 °C accuracy, greatly reducing thermal stress damage to chips;
3. Modular design: quick changeover between processes raises productivity by 30%, supporting advanced processes such as wafer-level packaging (WLP).
The equipment has been verified by leading companies, marking the entry of domestic vacuum reflow technology into the high-end market.

Market dynamics: surging demand drives expansion
According to SEMI, the global semiconductor packaging equipment market is expected to exceed USD 30 billion in 2025, with China accounting for over 35%. Driven by new-energy vehicles and AI servers, domestic orders for vacuum reflow equipment grew 45% year-on-year. Domestic vendors have won hundred-million-yuan orders in PV inverters and power modules; with cost-performance and localized service, domestic equipment is steadily replacing imports. Several local governments now subsidize up to 20% for purchases of domestic vacuum reflow equipment.

International competition: breaking barriers, going global
Overseas, Chinese equipment makers are breaking the monopoly of European and American technology. Huaxin recently signed a strategic cooperation with a German automotive-electronics giant to provide packaging solutions for automotive-grade IGBT modules. With stable soldering quality and fast delivery, Chinese equipment keeps gaining share in Southeast Asia and Europe; exports grew 58% year-on-year in the first half.

Expert view: technology iteration and supply-chain synergy are key
Li Ming, president of the packaging branch of the China Semiconductor Industry Association, commented: "The breakthrough in vacuum reflow soldering not only solves the bottleneck problem but also advances supply-chain self-reliance. Going forward, materials and software must be developed in synergy to build a complete domestic ecosystem." Zhang Chi, professor at Tsinghua University’s Institute of Microelectronics, noted that with the adoption of Chiplet technology, vacuum reflow will evolve toward higher precision and lower thermal damage, becoming a key technology of the post-Moore era.

Outlook: policy and market as twin engines
Under the 14th Five-Year Plan and semiconductor industry support policies, China’s vacuum reflow equipment market is expected to grow at over 15% CAGR from 2025 to 2030. As technology keeps iterating and the supply chain matures, domestic equipment is well positioned to take a place in the global high-end packaging market and help China’s semiconductor industry achieve independent breakthroughs.