
Guangdong Huaxin Equipment Co., Ltd. ("Huaxin") has added a dedicated floor to its office area in the Zhongji Digital Technology Industrial Park, Songshan Lake, Dongguan, officially upgrading it into a showroom for semiconductor equipment and process solutions. Focused on the company’s core technologies, the showroom displays self-developed vacuum thermal soldering equipment, semiconductor packaging and test equipment, and the latest process achievements, building an open platform for technical exchange and innovation across the semiconductor supply chain.
1. Positioning: a visual window on technical strength
The Huaxin showroom covers about 2,200 m² with three functional zones: equipment display, process demonstration and interactive experience.
The equipment zone presents the core product lines, including the vacuum die-bonding reflow furnace, formic-acid vacuum reflow system and four-chamber fully in-line formic-acid eutectic bonding furnace. These systems have achieved breakthroughs in power semiconductors, automotive electronics and 5G communication. The second-generation vacuum vapor-phase soldering system uses imported Galden® PFPE fluid from the USA, runs stably in extreme environments and reaches an industry-leading ±0.5 °C temperature uniformity. The process zone uses a real-time simulation system to demonstrate the complete flow from wafer pretreatment to soldering, packaging and test. The self-developed palladium-gold bump process is already in volume production with industry-leading yield, producing 10–20 µm high-density metal bumps and filling a gap in domestic wafer-level packaging and test.
The interactive zone is equipped with a virtual simulation system: on a touch screen, customers can adjust equipment parameters remotely and experience first-hand the intelligence and efficiency of Huaxin equipment.
2. Technical credentials: innovation driven by R&D and industry-academia cooperation
Huaxin’s strength comes from dual drivers: in-house R&D and joint laboratories with universities, cooperating deeply on vacuum soldering process optimization and material compatibility.
Patents and certification: the company has filed numerous patents covering low-temperature silver-nano sintering of semiconductor chip silver paste, automatic temperature-controlled reflow and other core technologies.
Industry recognition: the equipment has passed the GJB 322A-98 harsh-environment certification (national military standard), and Huaxin is a supplier to China Electronics Technology Group, Huawei Device and others. In a marine electronics project, Huaxin vacuum vapor-phase soldering equipment ran at full load for 72 consecutive hours with a yield of 99.85%, far above the 99.5% required.
3. Strategic significance: answering domestic substitution and industrial upgrading
China’s semiconductor industry is accelerating domestic substitution with strong policy support. The showroom is not only a showcase of achievements but a precise response to industry needs.
Domestic substitution: over 50% of core components (vacuum pumps, temperature-control modules) and process materials (formic-acid steam generators) are already sourced domestically, reducing dependence on imported technology.
Capacity planning: Huaxin achieved large-scale production in the first half of 2025. Through technology output via the showroom, the company plans to expand cooperation with wafer fabs and OSATs, with equipment deliveries in 2025 expected to grow 40% year-on-year.
4. Outlook: building an industry benchmark
Yang Bin, General Manager of Huaxin Semiconductor, said: "The new showroom will bridge R&D and market demand. Through open cooperation we want to tackle bottleneck problems together with partners across the supply chain and advance the localization of semiconductor equipment."
Industry cooperation: the showroom will regularly host technical seminars and customized solution launches, and plans to welcome more than 50 domestic and international semiconductor companies in 2025.
Technology iteration: the company is developing 112G PAM4 VCSEL chips and third-generation semiconductor packaging equipment; results will appear in the showroom, supporting emerging fields such as AI computing and 6G.
About Guangdong Huaxin Semiconductor Technology Co., Ltd.
Huaxin Semiconductor is a national high-tech enterprise dedicated to the R&D and production of vacuum thermal soldering equipment for semiconductors. Products cover power devices, automotive electronics and SMT soldering, with customers including Huawei, BYD and Foxconn. The company is ISO9001 certified and runs ERP+MES systems for full production traceability.
HQ Address: Unit 3, Building 2, Central Zone, Zhongji Digital Technology Industrial Park, Songshan Lake, Dongguan, Guangdong
East China Branch: 1F, Building 7B, Gemdale Weixin Intelligent Manufacturing Park, No.12 Qizi Road, Mudu Town, Wuzhong District, Suzhou
Sales Hotline: Wang Yanbin 13751004978
Vacuum Reflow Support: wyb@gdhxsemi.com
Vapor Phase Soldering Support: jtwvps@gdhxsemi.com
Mon - Fri: 8:30 - 17:30