In the semiconductor and electronics manufacturing industry, equipment innovation is often the key force driving progress. Guangdong Huaxin Semiconductor Technology Co., Ltd., backed by deep technical expertise and an innovative spirit, has recently launched several new devices covering vacuum reflow ovens, vertical furnaces and more. With breakthroughs in performance and functionality, they bring new solutions to power semiconductors, automotive electronics and SMT soldering. Let us take a closer look.

1. Second-generation vacuum vapor-phase soldering system — the core equipment for high-reliability electronics manufacturing

As the first engineering-applied vapor-phase soldering solution in China, the Huaxin second-generation system is designed for high-reliability scenarios such as military electronics, aerospace devices and marine navigation systems, solving the consistency problems of conventional soldering in extreme environments. The heat-transfer medium is imported Galden® PFPE fluid (USA) with a 215 °C boiling point, ultra-stable temperature control of 0.001 °C/s and insulation of 10¹⁶ Ω·cm, achieving a ±0.5 °C uniform temperature field through molecular-level heat conduction (150–210 °C process range).

The innovative dual-circulation condenser cooling system uses aerospace-grade aluminum micro-channel modules to adjust the vapor-zone temperature gradient within 30 seconds. Through a 7-inch industrial touch screen, engineers can configure 16-segment profiles in real time, meeting the stepped ramp requirements of QFP, BGA, CSP and other complex packages. Unlike single-condenser designs, the system automatically matches cooling power via a PID algorithm: when soldering 0.3 mm-pitch fine-pitch devices, solder-ball offset is kept within 5 µm, well below the industry average of 15 µm.

The device runs a customized Linux-based embedded OS with 128 layers of security hardening, certified to GJB 322A-98, and operates fault-free for 50,000 hours under wide temperature ranges, 95% RH non-condensing humidity and 10g@5–2000 Hz vibration. This was verified in a marine electronics project of China Electronics Technology Group: soldering 25 µm ultra-thin preforms for a shipborne radar T/R module, the yield stayed above 99.85% over 72 hours at full load — far exceeding the 99.5% requirement — making it the first domestic vacuum vapor-phase soldering equipment certified by China State Shipbuilding Corporation (CSSC).

2. Four-chamber fully in-line formic-acid eutectic bonding furnace — breaking the technical barriers of imported equipment

For eutectic bonding of power-semiconductor modules and IGBT chips, the Huaxin R&D team absorbed advanced German technology and developed a four-chamber linked formic-acid eutectic system with independent intellectual property. The core innovation is the fully water-cooled sealed structure: a 316L stainless-steel double-jacketed chamber with spiral-guide cooling tubes and food-grade fluororubber seals (Shore hardness 85±5A) raise the vacuum from 5×10^-3 mbar (imported equipment) to 3×10^-4 mbar, with a leak rate ≤5×10^-10 mbar·L/s. Measured data show seal life extended from 800 to 1,200 hours (+50%), preventive-maintenance intervals from 400 to 480 hours (+20%), and single-shift output of 1,200 pieces (+30% versus imported equipment).

Modular four-chamber design:

Preheat chamber (1): infrared radiation heating modules support 10–20 °C/s linear ramp for chip–DBC substrate preheat matching.

Eutectic chambers (2–3): built-in formic-acid steam generator with a mass-flow controller (0.1–5 vol% concentration) and 3D thermal-flow simulation; when soldering 10 mm×10 mm power chips, solder-layer thickness uniformity error is below 3%.

Cooling chamber (4): external 10 HP industrial chiller (±0.5 °C) with serpentine copper-tube arrays cools 600 °C workpieces below 100 °C within 90 seconds.

Unloading zone: automatic pick-and-place arm with an integrated AOI vision module gives real-time defect feedback (parts with void rate >10% are automatically rejected), closing the loop on process control.

In a new-energy vehicle ECU chip project the equipment redefined the process boundaries of precision soldering:

(1) Porous-array hot-air micro-circulation system

A 200+ hole flow-equalizing plate (0.8 mm holes, 2 mm pitch) with a 1.2 kW high-frequency centrifugal blower creates a laminar hot-air field of 0.3±0.05 m/s and temperature uniformity of ±1 °C (@230 °C soak zone). This eliminates the "shadow effect" when soldering 0402 and smaller components: the tombstone rate of 01005 resistors dropped from an industry average of 0.3% to 0.05%, and solder-climbing height consistency of 0201 capacitors improved by 40%.

(2) All-titanium alloy chamber structure

The vacuum chamber is built from TA2 pure titanium (tensile strength ≥345 MPa) with nano-scale anodizing (8–10 µm). Acid/alkali corrosion resistance is 3 times that of stainless steel, and service life in formic-acid and nitrogen atmospheres exceeds 8 years. The chamfer-free interior with an automatic back-blow cleaning system keeps flux residue below 5 µm, eliminating post-soldering leakage risks at the source.

(3) Ultra-long three-zone cooling system

The 1.2-meter cooling module is divided into three zones — rapid cooling (60 °C/s), slow cooling (20 °C/s) and equalization (10 °C/s) — each with an independent axial fan (500 CFM) and copper fins (1.5 mm pitch). Engineers can precisely adjust cooling slopes for different packages (Flip Chip, WLCSP): solder-foot cracking of 0.4 mm-pitch QFN devices dropped from 15% to below 2%, and thermal-resistance consistency improved by 60%.

The intelligent process library stores 200+ soldering profiles, automatically recalled via a barcode scanner, greatly simplifying process setup. In a leading consumer-electronics earphone PCBA line, the equipment soldered 01005-size capacitors and 0.3 mm-pitch BGAs in the same oven: 320 boards per cycle (+25% versus conventional equipment) with an overall yield above 99.92%, setting a benchmark for high-reliability soldering of miniature electronics.

Technical comparison

Specification | Huaxin | Imported brands | Advantage
Min. soldering pitch | 0.15 mm (01005) | 0.25 mm (0402) | Supports the finest assembly accuracy today
Vacuum level | 3×10^-4 mbar | 5×10^-3 mbar | 16× cleaner soldering atmosphere
Temperature uniformity | ±1 °C | ±2.5 °C | 60% wider process window
Seal life | 1,200 h | 800 h | 50% lower maintenance cost
Productivity | +30% | baseline | Industry-leading single-shift output

These breakthroughs fill domestic gaps in high-end soldering equipment and have been verified in demanding applications, making Huaxin a designated supplier for industry leaders such as China Electronics Technology Group, AVIC and Huawei Device. Through continuous innovation, Huaxin is driving Chinese high-end electronic manufacturing equipment from "usable" to "excellent" and onward to "leading".

The launch of the new equipment is not only a demonstration of technical strength but a precise response to industry needs. Huaxin will continue deepening R&D, bringing more innovations to semiconductor and electronics manufacturing and drawing a new blueprint for the industry together with its partners.