The machine is designed for semiconductor, vacuum pressure soldering, dispensing and gluing voids.

The machine adopts embedded system,not only stable & reliable, but has more abundant and convenient communication interface.

Recipe and MES are available with this machine.

Unique horizontal + vertical air convection, makes the temperature error smaller compared with traditional air module.

The equipment heating system adopts level 3 protection to effectively prevent over-temperature damage to the product.

With 10,000 level clean design, can be applied to any clean place.

Heating system adopts intelligent PID calculation, heat compensation is stronger, with lower energy consumption.

The machine has vacuum system and cooling system.